Improvement of a dicing blade using a whisker direction-controlled by an electric field

This paper discussed the way in which the mechanical feature of a new dicing blade was greatly improved via adding a whisker into light sensitive resin used as the bonding material. Considering the enhancing function of whisker in the length direction was greater than that in the diametral direction, an electric field was applied to make the direction of the whisker in the resin coincident with the direction of the load of the dicing blade. Using the electric field, a whisker in the resin was swerved to the direction of the electric force before the resin was solidified by ultraviolet radiation. The result shows that controlling the direction of the whisker in the resin by applying an electric field can greatly improve the mechanical properties of the dicing blade which is to be used in the processing of semi-conductors.