Title of article :
Finite element analysis of thermal shock tests of RF connectors
Author/Authors :
Z.Y. Zhu، نويسنده , , H.P. Lee، نويسنده , , B.T. Cheok، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Pages :
5
From page :
291
To page :
295
Abstract :
Digital or virtual testing of prototypes is frequently carried out in product design and testing for reducing the time as well as the cost of product development. An example on the thermal shock test of a radio frequency (RF) connector is presented. The thermal shock test of the RF connector is analyzed using the finite element method. The initial temperature condition of terminal and pin is assumed to be the room temperature (25 °C), and a cyclic temperature variation from −65 to 165 °C with a frequency of four cycles per hour is applied on the outer surfaces, similar to the thermal shock test under standard MIL-STD-883 test condition. The RF connector is found to work properly under these thermal shock loadings.
Keywords :
Thermal shock , Finite element analysis , Virtual testing , RF connector
Journal title :
Journal of Materials Processing Technology
Serial Year :
2005
Journal title :
Journal of Materials Processing Technology
Record number :
1179666
Link To Document :
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