An ultrasonic elliptical vibration cutting device for micro V-groove machining: Kinematical analysis and micro V-groove machining characteristics

Micro V-groove machining characteristics of an ultrasonic elliptical vibration cutting (UEVC) device have been experimentally investigated and compared with the conventional micro V-grooving. From the initial experiments performed on ductile material such as aluminum and brass with a single crystal diamond cutting tool, it was found that the cutting force was significantly decreased and the formation of burrs at the machining boundaries was greatly suppressed in the UEVC. The elliptical vibration of the cutting tool was achieved using two parallel stacked piezoelectric actuators with assembling metal structures. Kinematical analysis of the UEVC system has shown that the manipulation of the cutting tool path is possible by changing dimension of the mechanism, phase difference, and relative magnitude of the voltages applied to the piezoelectric actuators.