Investigation on reactive diffusion bonding of SiCp/6063 MMC by using mixed powders as interlayers

Mixed Al–Si, Al–Cu and Al–Si–SiC powders were used as interlayers to reactive diffusion bond SiCp/6063 MMC. The microstructure and the effects of bonding parameters on the shear strength of SiCp/6063 MMC joints were investigated. The results show that SiCp/6063 MMC joints bonded by using the interlayers of mixed Al–Si, Al–Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and the interlayers during bonding leads to the hypoeutectic microstructure of the joining layers. Using mixed Al–Si–SiC powder as an interlayer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer. This is responsible for the low shear strength of the joints, even lower than those reactive diffusion bonded by using the interlayers of mixed Al–Si and Al–Cu powders. Ti added in the interlayer obviously improves the joint strength reactive diffusion bonded by using the mixed Al–Si–SiC powder.