Title of article :
Effect of thermal cycling on the expansion behavior of Al/SiCp composite
Author/Authors :
Na Chen، نويسنده , , Hongxiang Zhang، نويسنده , , Mingyuan Gu، نويسنده , , Yanping Jin، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Abstract :
The coefficient of thermal expansion (CTE) and accumulated plastic strain of the pure aluminum matrix composite containing 50% SiC particles (Al/SiCp) during thermal cycling (within temperature range 298–573 K) were investigated. The composite was produced by infiltrating liquid aluminum into a preform made by SiC particles with an average diameter of 14 μm. Experiment results showed that the relationship between the CTE of Al/SiCp and temperature is nonlinear; CTE could reach a maximum value at about 530 K. The theoretical accumulated plastic strain of Al/SiCp composites during thermal cycling has also been calculated and compared with the experimental results.
Keywords :
Al/SiCp composite , Coefficient of thermal expansion , Plastic strain , Residual stress
Journal title :
Journal of Materials Processing Technology
Journal title :
Journal of Materials Processing Technology