Title of article :
Bond formation and fiber embedment during ultrasonic consolidation
Author/Authors :
Y. Yang، نويسنده , , G.D. Janaki Ram، نويسنده , , B.E. Stucker، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Pages :
10
From page :
4915
To page :
4924
Abstract :
The quality of ultrasonically consolidated parts critically depends on the bond quality between individual metal foils. This necessitates a detailed understanding of interface microstructures and ultrasonic bond formation mechanisms. In this work, the interface microstructures of a variety of ultrasonically consolidated similar and dissimilar metal samples were investigated. Samples with embedded SiC fibers were also investigated. Based on detailed microstructural studies, the mechanisms of foil bonding and fiber embedment in ultrasonic consolidation have been discussed.
Keywords :
Ultrasonic consolidation , Bonding mechanism , Fiber embedment , Ultrasonic metal welding , Metal matrix composites , Additive manufacturing , Interfacial microstructures
Journal title :
Journal of Materials Processing Technology
Serial Year :
2009
Journal title :
Journal of Materials Processing Technology
Record number :
1183586
Link To Document :
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