An improved remote sensing technique for estimating tool–chip interface temperatures in turning

This paper presents an improved remote thermocouple sensing technique for estimating cutting temperatures in a turning operation. The improved model can be used to monitor the transient cutting temperature in turning. The heat flux is estimated based on the measured remote temperature. Neither cutting forces nor heat partition factors are required for estimating the tool–chip interface temperatures. The computing time for the improved model is short. Thus the proposed remote sensing technique is suitable for industrial applications. Temperature-dependent thermal conductivity is considered in this study. Consequently, the influence of the remote sensor location on the accuracy of cutting temperature estimation is reduced. Both non-cutting tests and cutting tests are performed. Steady-state tool–chip interface temperature in cutting tests can be obtained in 5 s with the aid of Grooverʹs model. It is found that the estimation errors are less than 8% with the improved remote sensing technique.