Title of article :
Research on micro-electric resistance slip welding of copper electrode during the fabrication of 3D metal micro-mold
Author/Authors :
Bin Xu، نويسنده , , Xiao-yu Wu، نويسنده , , Jian-guo Lei، نويسنده , , Feng Luo، نويسنده , , Feng Gong، نويسنده , , Chenlin Du، نويسنده , , Xiu-quan Sun، نويسنده , , Shuang Chen Ruan، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Abstract :
3D micro-mold fabricated by the micro double-staged laminated object manufacturing process (micro-DLOM) is formed via stacking and fitting of multi-layer 2D micro-structures. The connection of 2D micro-structures is related to forming accuracy and mechanical properties of 3D micro-mold. In this research, micro-electric resistance slip welding of copper electrodes was proposed to connect multi-layer 2D micro-structures. Firstly, the proper process parameters of slip welding were obtained through the welding experiment, and the temperature field of micro-electric resistance slip welding under such process parameters was simulated. Secondly, deposition effect of the copper bar electrode produced during slip welding was studied and the study results show that the copper element deposited in the slip welding area decreases as the surface roughness of copper electrode decreases. Finally, based on the above research, a square micro-cavity mold with micro-channel, a circular micro-cavity mold with cross keyway and micro gear cavity mold with two-stage steps were welded by the micro-electric resistance slip welding.
Keywords :
3D metal micro structure , Micro-DLOM , Micro-electric resistance slip welding , Copper electrode
Journal title :
Journal of Materials Processing Technology
Journal title :
Journal of Materials Processing Technology