Aging study of rapidly solidified and solid-solution Cu–Cr–Sn–Zn alloy

The effects of different solution methods on aging microstructure and properties of Cu–Cr–Sn–Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu–Cr–Sn–Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.