Title of article
The cure behavior of tetraglycidyl diaminodiphenyl methane with diaminodiphenyl sulfone
Author/Authors
Gao Jiawu، نويسنده , , Shen Kui، نويسنده , , Gao Zong Mong، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2000
Pages
6
From page
153
To page
158
Abstract
It is well known that the preparation of an high-performance composite product depends not only on raw materials (resin and fiber) but also on the curing technological condition, or rather, the determination of the curing technological parameters. In this study torsional braid analysis (TBA) is used to study the cure behavior of tetraglycidyl diaminodiphenyl methane (TGDDM or Ag-80) with diaminodiphenyl sulfone (DDS), providing theoretical data for determining the curing condition of this resin matrix composites. Isothermal TBA technique is used to obtain a time–temperature-transformation (TTT) cure diagram, according to which the three different types of cure behavior are discussed. The data for Tg for different cure temperatures and times provide and estimation of the time to full cure vs. isothermal cure temperature for the resin system. An empirical Tg–Tc–time (TTT) equation is also developed.
Keywords
Cure behavior , TBA , Epoxy resin , TTT diagram , TTT equation
Journal title
Thermochimica Acta
Serial Year
2000
Journal title
Thermochimica Acta
Record number
1194693
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