Title of article
The thermal decomposition behaviors of stearic acid, paraffin wax and polyvinyl butyral
Author/Authors
Kuen-Shan Jaw، نويسنده , , Chung-King Hsu، نويسنده , , Jinn-Shinng Lee، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2001
Pages
4
From page
165
To page
168
Abstract
Organic processing additives, such as polymers, dispersants, solvents and plasticizers, are often required to enhance the forming capabilities of ceramic powders. The term binder system is used to collectively describe those added materials that remain in the as-formed ceramic body after drying. Such additives must then be removed completely prior to component densification during subsequent different heat treating procedures. In this work, the thermal decomposition behaviors of binder system such as stearic acid, paraffin wax and polyvinyl butyral were investigated using DTA/TG. The kinetic parameters of thermal decomposition were also evaluated by non-isothermal DTA/TG techniques.
Keywords
Paraffin wax , Stearic acid , Polyvinyl butyral , Thermal decomposition
Journal title
Thermochimica Acta
Serial Year
2001
Journal title
Thermochimica Acta
Record number
1194989
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