Title of article :
Relation between mobility factor and diffusion factor for thermoset cure
Author/Authors :
Yan Meng، نويسنده , , Sindee L. Simon، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2005
Pages :
11
From page :
179
To page :
189
Abstract :
The temperature-modulated differential scanning calorimetry (TMDSC) responses during cure of both epoxy/aromatic amine and dicyanate ester/polycyanurate systems are modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool–Narayanaswamy–Moynihan (TNM) equation. We investigate the assumption that the mobility factor, which may be obtained from experimental temperature-modulated differential scanning calorimetry reversing heat flow data, is related to the diffusion factor for the two systems.
Keywords :
Thermoset cure , Modulated DSC , TMDSC , Mobility factor , Diffusion factor , Physical aging
Journal title :
Thermochimica Acta
Serial Year :
2005
Journal title :
Thermochimica Acta
Record number :
1197043
Link To Document :
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