Title of article :
Enthalpies of mixing of liquid systems for lead-free soldering: Cu–Sb–Sn system
Author/Authors :
Dominika Jendrzejczyk-Handzlik، نويسنده , , Meryem Rechchach، نويسنده , , Wojciech Gierlotka، نويسنده , , Herbert Ipser، نويسنده , , Hans Flandorfer، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2011
Abstract :
Using two different types of high temperature drop calorimeters, partial and integral enthalpies of mixing of liquid alloys were determined in the ternary Cu–Sb–Sn system. The system was investigated along four sections at 1100 K. Experimental data were used to find ternary interaction parameters by applying the Redlich–Kister–Muggianu model for substitutional solutions, and a full set of parameters describing the concentration dependence of the enthalpy of mixing was derived. From these, the isoenthalpy curves were constructed for 1100 K. The entire system shows exothermic enthalpy of mixing at the given temperature.
Keywords :
Cu–Sb–Sn system , Enthalpy of mixing
Journal title :
Thermochimica Acta
Journal title :
Thermochimica Acta