Study on mold flow analysis of flip chip package

Flip chip package is the most important technology in IC package for the necessary for scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. It has the advantage of low cost, low interface and small volume in IC package. Since the flip chip package is developed by IBM Company in 1960. The meaning of flip chip package is turn over the chip for the connection between the metal conductor and PCB plate. This paper is indicated that the analysis package for the solder ball and chip for mold flow analysis. The analysis uses the sphere type, elliptic type of solder ball for column-row and cross arrangement. The package material uses for epoxy. The injection point uses for the corner, 1/4 side and central injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results discuss by the distribution of injection pressure, the pressure drop, temperature, filling time, welding line and air trap. It shows that the injection temperature and mold temperature are the mold factor for processing parameters. The results show that the air trap and welding line of corner injection are smaller then central and 1/4 side injection. It indicates that the corner injection is better than central and 1/4 side injection.