Title of article
THREE-DIMENSIONAL SIMULATION OF FLIP CHIP ENCAPSULATION PROCESS
Author/Authors
Y.K. Shen، نويسنده , , H.C. Lee & E.M. Baggs، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
10
From page
961
To page
970
Journal title
International Communications in Heat and Mass Transfer
Serial Year
2002
Journal title
International Communications in Heat and Mass Transfer
Record number
1219647
Link To Document