Title of article
STUDY ON WARPAGE AND SHRINKAGE OF FLIP CHIP ENCAPSULATION PROCESS
Author/Authors
Y.K. Shen، نويسنده , , J.H. Liao، نويسنده , , W.X. Zhao، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2004
Pages
10
From page
693
To page
702
Journal title
International Communications in Heat and Mass Transfer
Serial Year
2004
Journal title
International Communications in Heat and Mass Transfer
Record number
1219848
Link To Document