Title of article
Influence of interface materials on the thermal impedance of electronic packages
Author/Authors
G. De Mey، نويسنده , , J. Pilarski، نويسنده , , M. W?jcik، نويسنده , , M. Lasota، نويسنده , , J. Banaszczyk، نويسنده , , B. Vermeersch and G. De Mey، نويسنده , , A. Napieralski، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2009
Pages
3
From page
210
To page
212
Abstract
The thermal properties of different interface materials (grease, ceramic, silicone and mica) have been investigated using the thermal impedance Zth(jω) represented in a Nyquist plot. It will be shown that an interface material not only influences the thermal resistance Rth = Zth(0) but the entire shape of the thermal impedance Nyquist plot. From the wind tunnel experiments the specific contribution of the interface materials to the overall thermal resistance could be determined.
Keywords
Forced convection , Thermal Resistance , Interface materials
Journal title
International Communications in Heat and Mass Transfer
Serial Year
2009
Journal title
International Communications in Heat and Mass Transfer
Record number
1220458
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