3D numerical optimization of a heat sink base for electronics cooling

In this paper, the possible optimal thickness of a heat sink base has been explored numerically with different convective heat transfer boundary conditions in a dimensionless three dimensional heat transfer model. From the numerical results, relations among different heat transfer mechanisms (natural or forced, air or liquid), different area ratios of a heat sink to a heating source, and the lowest thermal resistance have been obtained and discussed. Also a simple correlation for these three parameters from data fitting is given for guiding a heat sink design.