Optimization of highly conductive insert architecture for cooling a rectangular chip

Conductive cooling of a rectangular chip heated from the bottom surface and connected to a heat sink is studied. Different configurations of a highly conductive material embedded in the chip are investigated and an optimal configuration for transferring heat to the heat sink is achieved. Our results indicate that the optimal configuration can be obtained by using side branches, parallel with the main channel, and also increasing the thickness of the main channel. Many complex configurations are checked and it is shown that these structures do not provide better performance.