Preparation, microstructure, and properties of novel low-κ brominated epoxy/mesoporous silica composites

Brominated epoxy resin (BER) composites containing various amounts of SBA-15 and SBA-16 types mesoporous silicas were prepared through the thermal curing with 3-methyl-tetrahydrophthalic anhydride, and their morphologies, dielectric constants (κ), thermal properties and mechanical properties were studied. The investigation suggested that the dielectric constant could be reduced from 4.09 of the pure thermosetting BER to 3.74 and 3.7 by incorporating 3 wt.% SBA-15 and SBA-16, respectively. The reduction of the dielectric constant is attributed to the incorporation of the air voids (κ = 1) stored within the mesoporous silica materials, the air volume existing in the gaps on the interfaces between the mesoporous silica and the BER matrix, and the free volume created by introducing large-sized domains. The BER/mesoporous silica composites also present stable dielectric constants across the wide frequency range. An improvement of thermal stability of the BER is achieved by incorporation of the mesoporous silica materials. The enhanced interfacial interaction between the surface-modified mesoporous silica and the BER matrix has also led to an improvement of the toughness.