Thermal ratcheting of solder-bonded elastic and elastoplastic layers

The cyclically growing deflection of solder-bonded elastic and elastoplastic layers subjected to cyclic thermal loading is studied. Finite element analysis of a Si/Sn–95Pb/OFHC-Cu layered structure is performed by taking into account the temperature-dependent viscoplastic behavior of Sn–95Pb as well as the uniaxial ratcheting behavior of OFHC-Cu. A temperature-dependent power law is employed for the viscoplasticity of Sn–95Pb, while a combined nonlinear kinematic and isotropic hardening model is assumed for the cyclic plasticity of OFHC-Cu. It is shown that the temperature-dependent viscoplasticity of Sn–95Pb and the uniaxial ratcheting of OFHC-Cu are the controlling factors for the cyclic growth of deflection of the layered structure under temperature cycling. It is also shown that cyclic hardening of OFHC-Cu plays an important role for the cyclic growth of deflection, and that elastic stress in the Si layer cyclically develops noticeably if the cyclic growth of deflection is significant.