A more consistent explanation of the strength of Al2O3/SiC nanocomposite after grinding and annealing

In a recent paper it was proposed that the strengthening of 5 vol% SiC Al2O3–SiC nanocomposite after grinding and annealing is attributable to flaw healing, in parallel with an oxidation reaction, which lead to a reduction in the density and size of flaws on annealing. Other authors have also favoured the flaw healing mechanism. However, the possibility that a mechanism based on dislocation activities might be mostly responsible has never been fully investigated. In this report the two mechanisms are investigated and it is demonstrated that the latter is more consistent with experimental observations. Possible sources of the ambiguity met in some of the explanations of the mechanisms behind the strengthening phenomenon are also identified.