Title of article :
On positive charge annihilation and stress-induced leakage current decrease
Author/Authors :
Mondon، F. نويسنده , , Jourdain، M. نويسنده , , Meinertzhagen، A. نويسنده , , Petit، C. نويسنده , , Gogenheim، D. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
Stress-induced leakage current (SILC) has several components. One of these components increases when the oxide thickness decreases. We show that this component can be reduced by application of a low field of opposite polarity to the stress field or by temperature annealing. When a positive charge is present in the oxide, this charge is also reduced. We show that these two effects are independent.
Keywords :
Thermal benchmark IC , Dynamic thermal modeling of IC packages , Measuring of thermal coupling in ICs
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY