Title of article :
Analysis of space and energy distribution of stress-induced oxide traps
Author/Authors :
Spinelli، A.S. نويسنده , , Lacaita، A.L. نويسنده , , Minelli، D. نويسنده , , Chiding، G. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
A new experimental method for the determination of the energy distribution of neutral traps in oxide is presented, based on an analysis of the transient SILC current. Results show that the stress damage is mostly located from about 2 to 2.7 eV from the oxide conduction band, and that a greater stress is generated at the anode side of the stress. Preliminary results of a detailed numerical model for the trap-assisted tunneling are presented, showing that an exponentially decaying trap profile within the oxide is needed to account for the discharge current transient.
Keywords :
Thermal benchmark IC , Dynamic thermal modeling of IC packages , Measuring of thermal coupling in ICs
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY