Title of article :
ONO and NO interpoly dielectric conduction mechanisms
Author/Authors :
Salvo، B. De نويسنده , , Ghibaudo، G. نويسنده , , Pananakakis، G. نويسنده , , Reimbold، G. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Pages :
-234
From page :
235
To page :
0
Abstract :
Interpoly stacked-dielectric conduction mechanisms are investigated. Extensive Si3N4 and SiO2 single-layer transport analysis leads to a clear multi-layer dielectric understanding. An improved carrier-separation model is proposed for a 35 A-thick SiO2 and applied to ONO results. NO electrical behavior is satisfactorily modelled under both gate polarities.
Keywords :
Dynamic thermal modeling of IC packages , Thermal benchmark IC , Measuring of thermal coupling in ICs
Journal title :
MICROELECTRONICS RELIABILITY
Serial Year :
1999
Journal title :
MICROELECTRONICS RELIABILITY
Record number :
12881
Link To Document :
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