Title of article :
Validation of radiation hardened designs by pulsed laser testing and SPICE analysis
Author/Authors :
Lewis، Bradley D. نويسنده , , Pouget، V. نويسنده , , Lapuyade، H. نويسنده , , Briand، R. نويسنده , , Fouillat، P. نويسنده , , Sarger، L. نويسنده , , Calvet، M.-C. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
A new pulsed laser system dedicated to the simulation of radiation effects on integrated circuits is presented. On-line testing capabilities are detailed and two SPICE models of radiation induced transient currents are proposed to be used for results analysis. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Electromigration , Aluminum alloys , Resistance measurements , Microstructural analysis
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY
