Title of article :
Gold removal in Failure Analysis of GaAs-based laser diodes
Author/Authors :
M.Vanzi، نويسنده , , A.Bonfiglio، نويسنده , , P.Salaris، نويسنده , , P.Deplano، نويسنده , , E.F.Trogu، نويسنده , , A.Serpe، نويسنده , , Salmini، G. نويسنده , , Palo، R. De نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
A great improvement of EBIC images on GaAs-based aged laser diodes is obtained by removing the gold metallization from the top surface. Gold removal, on the other hand, is troublesome and unreliable on aged devices, both under the chemical (I/KJ) or mechanical (peeling) approach. A new etch is presented, reliable for gold dissolution even on aged structures, and selective towards GaAs and its compounds. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Microstructural analysis , Electromigration , Aluminum alloys , Resistance measurements
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY
