• Title of article

    Device reliability and robust power converter development

  • Author/Authors

    Keskar، N. نويسنده , , Trivedi، M. نويسنده , , Shenai، K. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -1120
  • From page
    1121
  • To page
    0
  • Abstract
    This paper describes a top-down approach to reliability investigation of power electronic systems used in terrestrial and space applications. Results obtained from several case studies are presented that describe in detail both short-term and field failures of high-power DC-DC and AC-DC converters and the causes there-in. A systematic approach is presented that can be used to correlate field failures of power converters to residual defects and contaminants left in the semiconductor power switch, packaging and thermal management. Techniques and strategies that need to be applied in developing robust power converters for the next millennium are also outlined. © 1999 Elsevier Science Ltd. All rights reserved.
  • Keywords
    Resistance measurements , Electromigration , Microstructural analysis , Aluminum alloys
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    13107