Title of article :
Long term Reliability Testing of HV-IGBT modules in worst case traction operation
Author/Authors :
Fratelli، L. نويسنده , , Cascone، B. نويسنده , , Giannini، G. نويسنده , , G.Busatto، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
High reliability level is required for IGBT modules used in power converters in railway traction application which however are subject to high stress because of the typical cycling operation which causes thermomechanical fatigue. The paper reports about Ansaldo Trasporti activity in IGBTʹs reliability testing. Facility simulating worst case traction operation is described and the result after operation is presented: due to such stressing action, a solder delamination at the baseplate seems to be the first failure mechanism to be excited. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Electromigration , Microstructural analysis , Aluminum alloys , Resistance measurements
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY