Mathematical modeling of falling liquid film evaporation process

A mathematical model of evaporation process from a laminar falling liquid film on a vertical plate of constant temperature is presented. The model is developed with and without interfacial shear stress due to the vapor flow at the liquid film surface. The vapor pressure drop, vapor exit velocity and cooling rate are calculated for different liquid mass flow values. It is shown that lower liquid mass flow produces higher cooling rate. The results also show that the interfacial shear stress has a considerable negative effect on the cooling rate. It is proved that there exists an optimum distance between the plates, which gives the maximum volumetric cooling rate.