Three-dimensional asymptotic stress field in the vicinity of an adhesively bonded scarf joint interface

A recently developed three-dimensional eigenfunction expansion approach for prediction of the singular stress field in the neighborhood of the interfacial front of an adhesively bonded scarf joint is presented. The plate is subjected to extension/bending (mode I) and in-plane shear/twisting (mode II) far field loading. Each material is assumed to be isotropic and elastic, but with different material properties. Numerical results include the dependence of the lowest eigenvalue (or stress singularity) on the wedge aperture angle of the plate material. Variation of the same with respect to the shear moduli ratio of the component plate and adhesive layer materials is also an important part of the present investigation. Hitherto unobserved interesting and physically meaningful conclusions are also presented.