Title of article
Deposition of amorphous fluorosilane thin film on silicon surface: Atomic simulation
Author/Authors
Gou، نويسنده , , Fujun and Ming، نويسنده , , Xu and Weili، نويسنده , , Sun-Kang Chen، نويسنده , , T.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
5
From page
4186
To page
4190
Abstract
We utilized the Tersoff–Brenner potential form potential to investigate SiF3 continuously bombarding silicon surface with energies of 10, 50 and 100 eV at normal incidence and room temperature by molecular dynamics method. The saturation of deposition yield of F and Si atoms on the surface is observed. A F-containing amorphous layer is formed whose thickness increases with incident energy. In the ejected gas-phase species, F, SiF and SiF2 species increases with increasing incident energy, while the amount of SiF3 species decreases.
Keywords
chemical vapor deposition , Plasma deposition , Modeling and simulation
Journal title
Journal of Non-Crystalline Solids
Serial Year
2007
Journal title
Journal of Non-Crystalline Solids
Record number
1381658
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