Title of article
Computer simulations of nanoindentation on Cu (1 1 1) with a void
Author/Authors
Tan، نويسنده , , Chung-Ming and Jeng، نويسنده , , Yeau-Ren Jeng، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2009
Pages
6
From page
1884
To page
1889
Abstract
This paper employs static atomistic simulations to investigate the effect of a void on the nanoindentation of Cu (1 1 1). The simulations minimize the potential energy of the complete system via finite element formulation to identify the equilibrium configuration of any deformed state. The size and depth of the void are treated as two variable parameters. The numerical results reveal that the void disappears when the indentation depth is sufficiently large. A stress concentration is observed at the internal surface of the void in all simulations cases. The results indicate that the presence of a void has a significant influence on the nanohardness extracted from the nanoindentation tests.
Keywords
Nanoindentation , void , Hardness
Journal title
International Journal of Solids and Structures
Serial Year
2009
Journal title
International Journal of Solids and Structures
Record number
1387937
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