Title of article :
Multilayer thick-film technology as applied to design of microwave devices
Author/Authors :
Krasimira Kapitanova، نويسنده , , Polina V. and Simine، نويسنده , , Alexander V. and Kholodnyak، نويسنده , , Dmitry V. and Vendik، نويسنده , , Irina B.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
4
From page :
2941
To page :
2944
Abstract :
Possibilities of the sandwich multilayer technology to design microwave integrated circuits are discussed. Original designs of various passive microwave devices realized as multilayer sandwich structures are presented. Experimental results confirmed a good potential of the sandwich technology to design high-performance multilayer microwave integrated circuits.
Keywords :
Microwave integrated circuits (MICs)
Journal title :
Journal of the European Ceramic Society
Serial Year :
2007
Journal title :
Journal of the European Ceramic Society
Record number :
1408924
Link To Document :
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