Author/Authors :
S and Oelكner، نويسنده , , W. and Zosel، نويسنده , , J. and Guth، نويسنده , , U. and Pechstein، نويسنده , , T. and Babel، نويسنده , , W. and Connery، نويسنده , , J.G. and Demuth، نويسنده , , C. and Grote Gansey، نويسنده , , M. and Verburg، نويسنده , , J.B.، نويسنده ,
Abstract :
The encapsulation of ISFET sensor chips is a challenge to sensor technology and materials. Recently developed new packaging technologies enable reliable and cost effective chip encapsulation. By this, one of the serious problems, which had hindered the large-scale production and industrial application of ISFET sensors over three decades could be overcome now to a large extent. The paper reports both on ISFET encapsulation methods on laboratory level and advanced industrial production technologies. The influence of the packaging design on special applications and on the dynamic behaviour of the sensor is illustrated. Furthermore, sensor materials are characterised and various testing methods are described.
Keywords :
Response behaviour , ISFET , Chemical sensor , Packaging , Encapsulation , Steam sterilisation
