Multi-layered circuit board precisely pressed/damascened on glass plates

The authors introduce a pressing/damascening replication process on glass plates. As a prototype replication, the 20 μm line-wide circuit pattern was experimented. A male-patterned tungsten carbide mold hot-pressed against a glass plate to replicate the female pattern on the glass. Then the copper was deposited on the pressed glass, and was polished flat to produce the same copper damascened pattern. Next the three-layered circuit board was stacked and fixed by hot-pressing with only 2 μm error in the line width.