Title of article :
Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug‘n’play functionality
Author/Authors :
Perozziello، نويسنده , , Gerardo and Bundgaard، نويسنده , , Frederik and Geschke، نويسنده , , Oliver، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Abstract :
A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment.
ated fluidic interconnections appear to be a good solution for interconnecting polymer microsystems in terms of cost, space and performance. Following this path we propose a new reversible, integrated fluidic interconnection composed of custom-made cylindrical rings integrated in a polymer house next to the fluidic network. This allows plug‘n’play functionality between external metal ferrules and the system.
tical calculations are made to dimension and model the integrated fluidic interconnection.
e tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits.
Keywords :
Modelling , Packaging , Microfluidic systems , Fluidic interconnections
Journal title :
Sensors and Actuators B: Chemical
Journal title :
Sensors and Actuators B: Chemical