Title of article :
Surface modification-assisted bonding of polymer-based microfluidic devices
Author/Authors :
Myra T. and Tennico، نويسنده , , Yolanda H. and Koesdjojo، نويسنده , , Myra T. and Kondo، نويسنده , , Saki and Mandrell، نويسنده , , David T. and Remcho، نويسنده , , Vincent T.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Abstract :
This paper reports on the development and application of a surface modification technique as an improved method for bonding polymer microfluidic substrates. This technique readily produced complete microfluidic chips via plasma oxidation followed by silane reagent treatment on the polymer surface. Characterization of the bonded chips was performed using scanning electron microscopy (SEM), water contact angle measurement, and tensile strength measurement. SEM images showed that the integrity of the channel features was successfully preserved. A bond strength approaching that of solvent welding was demonstrated. This technique has been successfully applied to bond dissimilar polymer substrates (polymethylmethacrylate (PMMA), amorphous polyethylene terephthalate (APET), polycarbonate (PC)), and is also applicable to bonding a hard polymer substrate to polydimethylsiloxane (PDMS) or glass.
Keywords :
Surface modification , Tetraethyl orthosilicate , Poly(methylmethacrylate) , Microfluidics , hot embossing , fabrication
Journal title :
Sensors and Actuators B: Chemical
Journal title :
Sensors and Actuators B: Chemical