Title of article :
A post-bonding-free fabrication of integrated microfluidic devices for mass spectrometry applications
Author/Authors :
Kuo، نويسنده , , Shu-Ming and Yang، نويسنده , , Chao-Chi and Shiea، نويسنده , , Jentaie and Lin، نويسنده , , Che-Hsin، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Abstract :
This paper presents a novel process for fabricating integrated microfluidic devices with embedded electrodes which utilizes low-cost UV curable resins. Commercial UV glue is sandwiched between two substrates and is used for both the structural material and the bonding adhesive. During the exposure procedure, the pattern of micro-fluidic channels is defined using a standard lithography process while the two substrates are bonded. The un-cured UV glue is then removed by vacuum suction to form the sealed microfluidic channel. With this simple approach, conventional high-temperature bonding processes can be excluded in the fabrication of sealed microfluidic structures such that the developed method is highly advantageous for fabricating microchip devices with embedded electrodes. The overall time required to fabricate the sealed microchip device is less than 10 min since no time-consuming etching and bonding process is necessary. An innovative micro-reactor integrated with an in-channel micro-plasma generator for real-time chemical reaction analysis is fabricated using the developed process. On-line mass-spectrum (MS) detection of an esterification reaction is successfully demonstrated, which results in a fast, label-free, preparation-free analysis of chemical samples. The developed process can thus show its potential for rapid and low-cost microdevice manufacturing.
Keywords :
UV epoxy , Mass-spectrum , Microfluidic , Micro-plasma
Journal title :
Sensors and Actuators B: Chemical
Journal title :
Sensors and Actuators B: Chemical