• Title of article

    3D numerical simulation of filling and curing processes in non-isothermal RTM process cycle

  • Author/Authors

    Shi، نويسنده , , Fei and Dong، نويسنده , , Xianghuai، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2011
  • Pages
    7
  • From page
    764
  • To page
    770
  • Abstract
    It is important to simulate non-isothermal RTM process cycle due to the high speed of filling mold during the filling stage and the long curing period during the curing stage. In this paper, we present numerical formulations for resin flow based on the concept of quasi-steady state situation at the filling stage and for resin cure at the curing stage. To make sure the applicability to complex product shapes, we use the four-node unstructured tetrahedron mesh, based on which the numerical formulation of temperature and cure convection is developed. The validity of our method is established in the case where flexible meshes are used. The results show that the numerical procedure, tested on known data, provides numerically valid and reasonably accurate predictions.
  • Keywords
    3D Numerical Simulation , Unstructured tetrahedron mesh , Non-isothermal RTM
  • Journal title
    Finite Elements in Analysis and Design
  • Serial Year
    2011
  • Journal title
    Finite Elements in Analysis and Design
  • Record number

    1458106