Optimization of PECVD SiN:H films for silicon solar cells

We have grown silicon nitride (SiN:H) thin films on silicon and glass by the Plasma Enhanced Chemical Vapor Deposition (PECVD) Method at low temperature in order to study their electro-optical properties and correlate these properties to the chemical composition of the layers, so that optimum films may be achieved for silicon solar cells. By varying the silane to ammonia ratio in the plasma gas we have been able to modify the index of refraction, the optical band gap and the silicon surface state passivation properties of the films. From this information we have determined that the optimum silane to ammonia ratio, with other constant parameters in our system, should be 20/65. Our results indicate that the mid-gap surface state density in silicon can be reduced down to 1010 cm−2 eV−1 when this optimum (silane to ammonia) ratio is used for depositing SiN:H layers. We have confirmed this optimal ratio by making quantum efficiency measurements on silicon solar cells having their emitter passivated with SiN:H layers deposited with different silane to ammonia ratios. A great reduction of the surface recombination velocity was achieved, as observed from the internal quantum efficiency measurements, for cells with optimal SiN:H layers as compared to those with non-optimum SiN:H layers.