• Title of article

    Metallisation patterns for interconnection through holes

  • Author/Authors

    Burgers، نويسنده , , A.R and Bultman، نويسنده , , J.H and Tip، نويسنده , , A.C and Sinke، نويسنده , , W.C، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2001
  • Pages
    7
  • From page
    347
  • To page
    353
  • Abstract
    ECN has developed a new cell- and module-design for crystalline silicon solar cells called pin-up module (PUM). In this design a limited number of holes (typically 9 or 16) is used to interconnect the front-side metallisation to a foil at the rear side by using pins. In this way the busbars and tabs at the front side are eliminated resulting in several important benefits. The efficiency of the cell becomes independent of the cell area and the efficiency is higher compared to standard tabbed cells. Another benefit is the improved visual appearance. In this paper we discuss the design of the metallisation pattern for the cells. A theoretical analysis is presented that shows the gains of the PUM design over conventional cells.
  • Keywords
    Crystalline silicon , solar cells , Interconnection , Metallisation pattern , PUM
  • Journal title
    Solar Energy Materials and Solar Cells
  • Serial Year
    2001
  • Journal title
    Solar Energy Materials and Solar Cells
  • Record number

    1476824