Title of article :
Device simulation and modeling of microcrystalline silicon solar cells
Author/Authors :
Takakura، نويسنده , , H. and Hamakawa، نويسنده , , Y.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2002
Pages :
9
From page :
479
To page :
487
Abstract :
Device modeling for p–i–n junction basis thin film microcrystalline Si solar cells has been examined with a simple model of columnar grain structure utilizing two-dimensional device simulator. The simulation results of solar cell characteristics show that open-circuit voltage (Voc) and fill factor considerably depend on structural parameters such as grain size and acceptor doping in intrinsic layer, while short-circuit current density (Jsc) is comparatively stable by built-in electric field in the i-layer. It is also found that conversion efficiency of more than 16% could be expected with 1 μm grain size and well-passivated condition with 10 μm thick i-layer and optical confinement.
Keywords :
Grain boundary , Device simulation , amorphous silicon , Tandem solar cell , Recombination loss , Boittom cell , Optimum design , Microcrystalline Si solar cell
Journal title :
Solar Energy Materials and Solar Cells
Serial Year :
2002
Journal title :
Solar Energy Materials and Solar Cells
Record number :
1478268
Link To Document :
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