Title of article :
Application of EBSP to directional solidified Ni3Al
Author/Authors :
Wang، نويسنده , , Qiang Yang & Jun Zhu، نويسنده , , Jing and Han، نويسنده , , YaFang، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2000
Abstract :
A new method called EBSP (electron back scattered pattern) is applied to directional solidified Ni3Al alloy. The statistic of the GB that is usually implemented only in TEM can be carried out in SEM too. From OIM (orientation imaging microscopy) of both samples, the statistic of coincide site lattice (CSL) of dendrite GB can be acquired. Through the statistic, percentage of boundary in the longitudinal and transverse direction of both samples can be obtained.
Keywords :
F. Electron microscopy , scanning , C. Rapid solidification processing , A. Nickel aluminides based on Ni3Al , D. Grain-boundary character distribution
Journal title :
Intermetallics
Journal title :
Intermetallics
