• Title of article

    Effects of number of reflows on the mechanical and electrical properties of BGA package

  • Author/Authors

    Noh، نويسنده , , B.I. and Koo، نويسنده , , J.M. and Kim، نويسنده , , J.W. and Kim، نويسنده , , D.G. and Nam، نويسنده , , J.D. and Joo، نويسنده , , J. and Jung، نويسنده , , S.B.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2006
  • Pages
    4
  • From page
    1375
  • To page
    1378
  • Abstract
    Mechanical and electrical properties of the Sn–37Pb/Cu joints were investigated in terms of the effect of intermetallic compound (IMC) layer growth. A layer of continuous scallop-shaped Cu6Sn5 IMC was formed at the interface between the solder and substrate after 1 reflow, while Cu3Sn IMC layer was formed after 3 reflows. The thickness of the total IMC layer increased as a function of cubic root of reflow time. The shear force of the solder joints did not vary much with the number of reflows. Only ductile failure mode was observed regardless of the number of reflows, and explaining well the shear force variations. The electrical resistivity of the BGA package was measured to investigate the relation between the microstructural variation and electrical properties of the solder joints. The electrical resistivity increased with the number of reflows.
  • Keywords
    B. Diffusion , B. Electrical resistance and other electrical properties , C. Joining , A. Intermetallics , miscellaneous
  • Journal title
    Intermetallics
  • Serial Year
    2006
  • Journal title
    Intermetallics
  • Record number

    1503749

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=1503749