Title of article
First-principle study on substitution of Cu or P into Ni–Sn intermetallic compounds
Author/Authors
Chung، نويسنده , , T.J. and Moon، نويسنده , , W.H. and Park، نويسنده , , Y.G. and Kim، نويسنده , , M.C. and Choi، نويسنده , , C.K.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
7
From page
1228
To page
1234
Abstract
The effect on substitution of Cu or P into the Ni–Sn intermetallic compound (IMC) is examined by analyzing the electronic structure based on first-principle calculation. When the Cu atom is substituted for the Ni one in Ni3Sn2, the resulting Ni–Cu–Sn IMC was energetically unstable, and then it had the higher electrical conductivity by the light electron effective mass. Meanwhile, when the P atom is replaced by the Sn one, the Ni–Sn–P IMC had the higher bulk modulus by the strong p–d hybridization between Ni and Sn or P, and also its electrical conductivity is lessen by the heavy electron effective mass.
Keywords
A. Intermetallics , B. Electronic structure of metals and alloys , B. Bonding , miscellaneous
Journal title
Intermetallics
Serial Year
2010
Journal title
Intermetallics
Record number
1504700
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