Author/Authors :
Choi، نويسنده , , Hyelim and Lee، نويسنده , , Tae Kyu and Kim، نويسنده , , Yunsung and Kwon، نويسنده , , Hoon and Tseng، نويسنده , , Chien-Fu and Duh، نويسنده , , Jenq-Gong and Choe، نويسنده , , Heeman، نويسنده ,
Abstract :
The mechanical properties of new lead-free Sn–Ag–Cu solder alloys containing 0.05–0.1 wt.% boron were investigated under a range of isothermal aging and reflow conditions. The boron-doped solder joints showed higher ball pull strength than the baseline Sn-1.0Ag-0.5Cu solder joint under all isothermal aging and reflow conditions examined. In particular, the high-speed ball pull strength of the 0.05 wt.% B-doped solder joint was approximately 2.5 times greater than that of the baseline Sn-1.0Ag-0.5Cu solder joint aged at 150 °C for 200 h, which is attributed mainly to the reduced rate of grain growth in the intermetallic compound (IMC) layers of B-doped solder joints under aging conditions.
Keywords :
F. Trace element analysis , B. Grain growth , B. Microalloying , A. Ternary alloy systems , B. Alloy design
