Title of article
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
Author/Authors
Chen، نويسنده , , Wei-Yu and Chiu، نويسنده , , Tsung-Chieh and Lin، نويسنده , , Kwang-Lung and Lai، نويسنده , , Yi-Shao، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2012
Pages
4
From page
40
To page
43
Abstract
The electrorecrystallization, recrystallization driven by electrical current stressing, of Cu6Sn5 intermetallic compound occurs in a Sn0.7Cu flip chip solder bump. The Cu6Sn5 dissolves in Sn0.7Cu at 1.0 × 104 A/cm2 of current stressing under 150 °C. The Cu flux in the solder joint, driven by the combination force of thermal gradient and electromigration, flows toward the cold side of the solder joint. The segregation of Cu results in recrystallization and thus redistribution of IMC at the cold side of the solder joint after current stops.
Keywords
miscellaneous , C. Recrystallization and recovery , B. Diffusion , B. Precipitates , A. Intermetallics , D. Microstructure
Journal title
Intermetallics
Serial Year
2012
Journal title
Intermetallics
Record number
1505353
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