• Title of article

    Solute redistribution during planar growth of intermetallic compound with nil solubility

  • Author/Authors

    Liu، نويسنده , , Dongmei and Li، نويسنده , , Xinzhong and Su، نويسنده , , Yanqing and Luo، نويسنده , , Liangshun and Guo، نويسنده , , Jingjie and Fu، نويسنده , , Hengzhi، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2012
  • Pages
    5
  • From page
    131
  • To page
    135
  • Abstract
    Planar growth of a stoichiometric intermetallic compound, Al9Co2, is first experimentally confirmed in directionally solidified Al-11at%Co alloy. Based on the principle of solute conservation, the solute redistribution equations during planar growth of a stoichiometric intermetallic compound are obtained. When diffusion is the solute transport mode in the melt, a linear equation is obtained to evaluate the variation of the solute concentration in the liquid at the solid/liquid interface front with the freezing distance. For planar growth of intermetallic compound with nil solubility, there is no steady state boundary layer at the solid/liquid interface front, unless the initial composition of the melt is equal to the composition of the intermetallic compound. Experimental and theoretical work demonstrates that planar growth of the two constituent intermetallic compound phases can lead to a banded structure in a peritectic system.
  • Keywords
    B. Diffusion , C. Crystal growth , A. Intermetallics
  • Journal title
    Intermetallics
  • Serial Year
    2012
  • Journal title
    Intermetallics
  • Record number

    1505367