Lightweight electronic packaging technology based on spray formed Si-A

A new family of spray formed Si-AI alloys has been developed for electronic applications. Their physical characteristics, combining low thermal expansivity, high thermal conductivity, and low density, make them attractive for packaging of avionics, including rf and microwave circuitry. These alloys are easy to machine to tight tolerances and can be electroplated with gold, silver, or nickel finishes. Being non-toxic, they do not require any special handling. Microwave amplifier modules designed for space applications, providing weight savings of 30% over conventional packages, have been successfully produced and tested.